Our Facilities at a Glance | Toshiba TEC Singapore

OEM/ODM SERVICES

Qualification Capabilities and Facilities

Non Destructive Analysis for BGA After Rework

Environmental Test

High Speed Image Capturing

3D X-Ray Analysis and Non Destructive Failure Analysis

EMI Verification Test

Thermal Shock Chamber

Nondestructive & Rapid Analysis of RoHS Elements

Interface Compliance Test

Splash Test

Ball Grid Array (BGA) Re-balling & Replacement

Functional Flex Test

Dust Test

Walk-In Chamber

Spill Test

ESD Measurement

Magnetic Field Immunity

Conducted Emission Measurement